View MR2535L_1120851.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

MR2535L Overvoltage Transient Suppressors
Medium Current
Designed for applications requiring a low voltage rectifier with reverse avalanche characteristics for use as reverse power transient suppressors. Developed to suppress transients in the automotive system, these devices operate in the forward mode as standard rectifiers or reverse mode as power avalanche rectifier and will protect electronic equipment from overvoltage conditions.
Features http://onsemi.com
* * * * *
Avalanche Voltage 24 to 32 V High Power Capability Economical Increased Capacity by Parallel Operation Pb-Free Packages are Available*
MICRODE AXIAL CASE 194 STYLE 1
Mechanical Characteristics:
* Case: Epoxy, Molded * Weight: 2.5 Grams (Approximately) * Finish: All External Surfaces Corrosion Resistant and Terminal * *
Leads are Readily Solderable Maximum Lead Temperature for Soldering Purposes: 350C 3/8 from Case for 10 Seconds at 5 lbs. Tension Polarity: Indicated by Diode Symbol or Cathode Band
MARKING DIAGRAM
MR2535LAYYWW G G
MAXIMUM RATINGS (TJ = 25C unless otherwise noted)
Rating DC Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Repetitive Peak Reverse Surge Current (Time Constant = 10 ms, Duty Cycle 1%, TC = 25C) Average Rectified Forward Current (Single Phase, Resistive Load, 60 Hz, TC = 125C) (Figure 4) Non-Repetitive Peak Surge Current Surge Supplied at Rated Load Conditions Halfwave, Single Phase Operating and Storage Junction Temperature Range Symbol VRRM VRWM VR IRSM Value 20 Unit V A YY WW G = Assembly Location = Year = Work Week = Pb-Free Package
62
A
(Note: Microdot may be in either location) IO 6.0 A
ORDERING INFORMATION
IFSM 600 A Device MR2535L TJ, Tstg -65 to +175 C MR2535LG MR2535LRL MR2535LRLG Package Microde Axial Microde Axial (Pb-Free) Microde Axial Microde Axial (Pb-Free) Shipping 1000 Units/Box 1000 Units/Box 800/Tape & Reel 800/Tape & Reel
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
(c) Semiconductor Components Industries, LLC, 2006
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Publication Order Number: MR2535L/D
1
June, 2006 - Rev. 7
MR2535L
THERMAL CHARACTERISTICS
Characteristic Thermal Resistance, Junction-to-Lead @ Both Leads to Heatsink, Equal Length Thermal Resistance Junction-to-Case Lead Length 1/4 3/8 1/2 Symbol RqJL Max 7.5 10 13 0.8 (Note 1) Unit C/W
RqJC
C/W
ELECTRICAL CHARACTERISTICS (TJ = 25C unless otherwise noted)
Characteristic Instantaneous Forward Voltage (Note 2) (iF = 100 A, TC = 25C) Reverse Current (VR = 20 Vdc, TC = 25C) Breakdown Voltage (Note 2) (IR = 100 mAdc, TC = 25C) Breakdown Voltage (Note 2) (IR = 90 A, TC = 150C, PW = 80 ms) Breakdown Voltage Temperature Coefficient Forward Voltage Temperature Coefficient @ IF = 10 mA 1. Typical. 2. Pulse Test: Pulse Width 300 ms, Duty Cycle 2%. IF, INSTANTANEOUS FORWARD CURRENT (A) Symbol vF IR V(BR) V(BR) V(BR)TC VFTC Min - - 24 - - - Max 1.1 200 32 40 0.096 (Note 1) 2 (Note 1) Unit V nAdc V V %/C mV/C
1000
1000 IR, REVERSE CURRENT (nA) VR = 20 V 100
100 TJ = 125C
75C
10
25C 10
1
0.1 0.01
1 600 700 800 900 1000 VF, INSTANTANEOUS FORWARD VOLTAGE (mV)
25
50
75
100
125
150
TJ, JUNCTION TEMPERATURE (C)
Figure 1. Typical Forward Voltage
IF(avg), AVERAGE FORWARD CURRENT (A)
Figure 2. Typical Reverse Current versus Junction Temperature
25 Both leads to heatsink with equal length IF(peak)/IF(avg) = p
4000 3500 C, CAPACITANCE (pF) 3000 2500 2000 1500 1000 0 5 10 15 20 25 VR, DC BLOCKING VOLTAGE (V) TJ = 25C
20
15 10 mm L = 6.25 mm 10 15 mm
5 0 20 40 60 80 100 120 140 160 180 TL, LEAD TEMPERATURE (C)
Figure 3. Typical Capacitance
Figure 4. Maximum Current Ratings
http://onsemi.com
2
MR2535L
1 r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED) R qJL, THERMAL RESISTANCE JUNCTION TO LEAD ( C/W) 45 40 35 30 25 20 15 10 5 0 0.001 0.01 0.1 t, TIME (S) 1 10 100 0 5 Both leads to heatsink (equal length) 10 15 20 25 Typical Typical Single to heatsink Maximum Maximum
0.1
L = 6.25 mm, both leads to heatsink (equal length) 0.01
LEAD LENGTH (mm)
Figure 5. Thermal Response
Figure 6. Steady State Thermal Resistance
IRSM, PEAK REVERSE CURRENT (A)
100 TJ = 25C
10000 PRSM, PEAK REVERSE POWER (W) TJ = 25C
1000
10 1 10 100 1000 t, TIME CONSTANT (mS)
100 1 10 100 1000 t, TIME CONSTANT (mS)
Figure 7. Maximum Peak Reverse Current
Figure 8. Maximum Peak Reverse Power
1000 W RSM, PEAK REVERSE ENERGY (J) PEAK REVERSE POWER (W)
2400 2000 1600 1200 800 400 0 1 10 100 1000 25 50 75 100 125 150 t, TIME CONSTANT (mS) TL, LEAD TEMPERATURE (C) Time Constant = 10 mS
TJ = 25C 100
10
Time Constant = 100 mS
1
Figure 9. Maximum Reverse Energy
Figure 10. Reverse Power Derating
http://onsemi.com
3
MR2535L
1.20 1.18 V Z(Irsm) /V Z(100 mA) 1.16 1.14 1.12 1.10 1.08 1.06 1.04 1.02 1.00 10 20 30 40 50 60 70 80 90 100 110 120 IRSM, REPETITIVE PEAK REVERSE SURGE CURRENT (A) PW = 80 mS, TL = 25C
Figure 11. Typical Clamping Factor
2W
dl/dt Limitation 100 mH
0 - 150 V
50 mF
MR2535L
Figure 12. Load Dump Test Circuit
100 dl/dt < 1 A/ms 80
60 (%) 40 20 0 0 0.1 t (50%) t (37%) 0.2 t (10%) t, TIME (S) 0.3 0.5 0.4 t (37%) = Time Constant t (50%) = 0.7 t (37%) t (10%) = 2.3 t (37%)
Figure 13. Load Dump Pulse Current
http://onsemi.com
4
MR2535L
PACKAGE DIMENSIONS
MICRODE AXIAL CASE 194-04 ISSUE H
A D
1 NOTES: 1. CATHODE SYMBOL ON PACKAGE. 2. 194-01 OBSOLETE, 194-04 NEW STANDARD. MILLIMETERS INCHES DIM MIN MAX MIN MAX A 8.43 8.69 0.332 0.342 B 5.94 6.25 0.234 0.246 D 1.27 1.35 0.050 0.053 K 25.15 25.65 0.990 1.010 STYLE 1: PIN 1. CATHODE 2. ANODE
K
B K
2
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative
http://onsemi.com
5
MR2535L/D

▲Up To Search▲

Price & Availability of MR2535L

	To Download MR2535L Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .